IC Development Kit: 11 Prototype Boards for TQFP, UFQFPN, VFQFPN, SSOP, LQFP, and SOIC-D - Perfect for Electronics Prototyping

Overview:

Elevate your electronics development with our versatile IC Development Kit, featuring 11 meticulously designed prototype (market) boards. Catering to a wide array of IC packages including UFQFPN28, UFQFPN32, VFQFPN36, UFQFPN48, LQFP48, TQFP64, VFQFPN68, SSOP (0.65 pitch, breadboard-adapted), and SOIC-D (16/1SC-70, breadboard-adapted), this kit is engineered to support your innovative projects from concept through to testing.

Benefits:

• User-Friendly Design: With clear labeling, easy-to-access ports, and a straightforward interface, each board is built to facilitate an intuitive development experience, regardless of your skill level.

• Accelerate Your Projects: Save time with a ready-to-use solution that simplifies the prototyping process, allowing you to focus on innovation and design.

• Enhance Your Learning: Whether you're a student or a professional looking to expand your skill set, our kit offers a hands-on approach to understanding and applying electronic principles.

• Versatility: From IoT devices to consumer electronics prototypes, the possibilities are endless, providing you with the flexibility to explore various fields and applications.

 

Ideal for:

• Electronics Engineering Students
• DIY Electronics Hobbyists
• Professional Engineers and Designers
• Tech Educators and Tutors
  
  

Specifications:

All boards are 2-layer with full pins enumeration

• UFQFPN28 - 1 pc;
  Dim: 33x33 mm; 
  2 through-hole pads for each pin;
  4 through-hole pads for ground and 4 for power delivery isolated from IC, corresponding for top and bottom copper layers;
  Pinch: 0.5mm
  
  
• UFQFPN32 - 1 pc;
  Dim: 36x36 mm; 
  2 through-hole pads for each pin
  4 through-hole pads for ground and 4 for power delivery isolated from IC, corresponding for top and bottom copper layers;
  Ground IC pad connected to ground pins;
  Pinch: 0.5mm
  
  
• VFQFPN36 - 1 pc;
  Dim: 38x38 mm; 
  2 through-hole pads for each pin;
  4 through-hole pads for ground and 4 for power delivery isolated from IC, corresponding for top and bottom copper layers;
  Ground IC pad connected to ground pins;
  Pinch: 0.5 mm
  
  
• UFQFPN48 - 1 pc;
  Dim: 48x48 mm; 
  2 through-hole pads for each pin;
  4 through-hole pads for ground and 4 for power delivery isolated from IC, corresponding for top and bottom copper layers;
  Ground IC pad connected to ground pins;
  Pinch: 0.5 mm
  
  
• LQFP48 - 1 pc;
  Dim: 46x46 mm; 
  2 through-hole pads for each pin;
  4 through-hole pads for ground and 4 for power delivery isolated from IC, corresponding for top and bottom copper layers;
  Pinch: 0.5 mm
  
  
• TQFP64 - 1 pc;
  Dim: 51x51 mm; 
  2 through-hole pads for each pin;
  4 through-hole pads for ground and 4 for power delivery isolated from IC, corresponding for top and bottom copper layers;
  Pinch: 0.5mm
  
  
• VFQFPN68 - 1 pc;
  Dim: 51x51 mm; 
  2 through-hole pads for each pin;
  4 through-hole pads for ground and 4 for power delivery isolated from IC, corresponding for top and bottom copper layers;
  Ground IC pad connected to ground pins;
  Pinch: 0.4 mm 
  
  
• SSOP (Bread board adapted) - 2 pc
  Dim: 16x31 mm;
  Bread Board Compatible;
  Power Layers;
  24 pins;
  Pinch: 0.65
  
  
• SOIC-D - 16/1sc-70 (Bread board adapted) - 2pc
  Dim: 16x21 mm;
  Bread Board Compatible;
  16 pins;
  Pinch: 1.27